Alumina 96% PCB

Most used ceramic PCB; strong thermal dielectric with low expansion

Aluminum Oxide (Al2O3) 96% or Alumina 96% is the most used ceramic material for ceramic printed circuit boards and packages. Thanks to its good thermal properties, low expansion, and hermeticity in combination with a relatively low cost and more easy handling. Applications include cooling and heating applications, LED boards, medical circuits, sensor modules, and high-frequency devices.

CERcuits supplies Alumina Oxide (Al2O3) 96%  manufactured both by thick film process as well as Direct Plated Copper Technologies (DPC) to print the circuits.

At CERcuits, we offer two solutions
– C-Proto: Our in-house solution which is perfect for samples, prototypes, and small volume programs. PCBs are made in Belgium at a quick turnaround without the need for any tooling. Speeding up your development while reducing your budget. Quotes & orders can be done 100% online via our portal.
– C-Production: Our medium to high volume solution. Together with our production partners, we can ensure competitive pricing, the right manufacturing footprint & tailored supply chain solutions for your volume program.

Hence, circuits can be made using Copper (Cu) or Silver (Ag) depending on the application and the request. Copper is offered in DPC and silver using a thick film process. We advise copper in 1-2 layer applications from low to high volume applications. Silver is advised when you need multi-layer and high-temperature resistance. In case you are unsure what material to specify, please do not hesitate to contact us.

Solder resist and surface finishes can be applied similarly to regular PCB when copper metallization is used. However, for silver thick film designs, we offer only a glass solder mask which is recommended for high-temperature designs. For high sulfur environments where silver corrosion can be an issue, we offer Gold plating as a solution to protect the exposed pads.

Alumina 96% PCB advantages:
  • High operating temperature up to 350ºC
  • Low expansion coefficient (6-8 ppm/ºC)resulting in lower stress on solder joints
  • Good thermal properties (22-24 W/mK)
  • Superior high-frequency performance
  • Smaller package size due to integration and multi-layer possibilities
  • Hermetic packages possible, 0% water absorption
  • Good light reflection due to white color.
  • Limited to no outgassing
  • Strong rigid material

To learn more about our other ceramic & ceramic PCB solutions. Click on one of the links below:

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